Ultrasonic soldering of Cu and al2o3 ceramics by use of Bi-La and Bi-Ag-La solders

Roman Koleňák, Michal Prach, Igor Kostolný

Ultrasonic soldering of Cu and al2o3 ceramics by use of Bi-La and Bi-Ag-La solders

Číslo: 2/2016
Periodikum: Acta Polytechnica
DOI: 10.14311/AP.2016.56.0126

Klíčová slova: ultrasonic soldering, Bi–based solder, lanthanum, Al2O3 ceramic, Ultrazvukové pájení, pájka na bázi Bi, lanthan, keramika Al2O3

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Anotace: This work deals with the effect of solder alloying with a small amount of lanthanum on joint formation with metallic and ceramic substrate. The Bi-Ag – based solder with 2 wt.% lanthanum addition and Bi solder with 2 wt.% lanthanum addition were studied. Soldering was performed by a

fluxless process on the air, by activation with a power ultrasound. It was found out that, during the process of ultrasonic soldering, lanthanum is distributed on the boundary, both with the copper and the ceramic substrate, which enhances the joint formation. The bond with Al2O3 ceramics is of an adhesive character, without the formation of a new contact interlayer.